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  • Hacker Fab Documentation
  • Overview
    • ✨Current Fab Capabilities
  • 🟡Guides
    • Build-a-Fab
    • Filling in the Gaps - Background Resources
    • Part Sourcing
  • 📜Processes
    • Self-Aligned NMOS V1
  • Fab Toolkit
    • 🎥Patterning
    • 🧱Deposition
    • 🕳️Etching
    • 🛠️Annealing
    • Electronic Design Automation
    • 🔍Metrology / Characterization
      • Probe Station
      • Semiconductor Parameter Analyzer
      • CV Measurements
      • IC Packaging
      • Scanning Tunneling Microscope
    • 🏘️Submodules
    • 📚Database
  • 🧑‍🍳Standard Operating Procedures
    • Patterning SOP - Stepper V2
    • Plasma Etcher SOP
    • Spin on Glass/Diffusant SOP
    • Tube Furnace SOP
    • Glass Acid Etch SOP
    • Thermal Evaporator SOP (CMU Version)
    • MTI Evaporator SOP (No longer in use)
    • Aluminum Etch SOP
    • Probe Station SOP
    • Probe Station SOP - V2
    • Wafer Cleaving SOP
    • Dry Oxide Growth SOP
    • Profilometer SOP
    • KLayout Mask Generation SOP
  • 🟢WORKING DOCS
    • CMOS Source/Drain Metal Contact Optimization
    • CMOS Doping Process Development
    • Sputtering Gate Oxides + Metal Gate Contacts
    • NAND + Inverter Characterization
    • CMU Updates
  • 🔲Templates (to do)
    • Build Manual Template
    • Bought Equipment Template
    • Standard Operating Procedure Template
    • BOM Template
    • Hardware X Template (for reference)
  • Archive
    • Patterning SOP - Stepper V1
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  1. Fab Toolkit
  2. 🔍Metrology / Characterization

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