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  • Hacker Fab Documentation
    • Contribution Guidelines
    • Build-a-Fab
    • Filling in the Gaps - Background Resources
    • Part Sourcing
    • ✨Self Aligned NMOS
    • 💻CMOS - sputtered gate stack (WIP)
    • 🔬 Research Tools
    • 🎥Patterning
      • Lithography Stepper V2.1+ Build
      • Lithography Stepper V2 Build
      • Lithography Stepper V1 Build
      • Getting started with Klayout
      • Multi-Layer Tiling
    • 🧱Deposition
    • 🕳️Etching
    • 🛠️Annealing
    • Electronic Design Automation
    • 🔍Metrology / Characterization
    • 🏘️Submodules
    • 📚Database
    • Patterning SOP - Stepper V2
    • Plasma Etcher SOP
    • Spin on Glass/Diffusant SOP
    • Tube Furnace SOP
    • Glass Acid Etch SOP
    • Thermal Evaporator SOP (CMU Version)
    • MTI Evaporator SOP (No longer in use)
    • Aluminum Etch SOP
    • Probe Station SOP
    • Probe Station SOP - V2
    • Wafer Cleaving SOP
    • Dry Oxide Growth SOP
    • Profilometer SOP
    • BOE chemical waste disposal SOP (UWaterloo)
    • Tip Etcher - WIP
    • Nanopositioner - WIP
    • CMOS Source/Drain Metal Contact Optimization
    • CMOS Doping Process Development
    • Sputtering Gate Oxides + Metal Gate Contacts
    • NAND + Inverter Characterization
    • CMU Updates
    • Build Manual Template
    • Bought Equipment Template
    • Standard Operating Procedure Template
    • BOM Template
    • Hardware X Template (for reference)
    • Carnegie Mellon University
    • University of Waterloo
    • Ohio State University
    • University of California: Irvine
    • Wroclaw University of Science and Technology
    • Indian Institute of Technology Bombay
    • Case Western Reserve University
    • University of British Columbia
    • University of Illinois Urbana-Champaign
    • Georgia Institute of Technology
    • Patterning SOP - Stepper V1
  • ChemicalWasteDisposalforBOESOP
  • OpticalMicroscopySOP
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For the complete documentation index, see llms.txt. This page is also available as Markdown.
  1. Fab Toolkit
  2. 🎥Patterning
  3. Blu-Ray Lithography
  4. Lithography Spinner V1
  5. Documentation

Design Datasheets

Datasheets Used in the OPU Driver PCB

1MB
CH569DS1-2.PDF
PDF
Open
1MB
EPC21603_datasheet.pdf
PDF
Open
2MB
hd3ss3220.pdf
PDF
Open
2MB
lmk3h0102.pdf
PDF
Open
3MB
max1304-max1314.pdf
PDF
Open
611KB
max40025a-max40026.pdf
PDF
Open
2MB
tpic2010.pdf
PDF
Open

ECP5 Files

25KB
ECP5UMcsfBGA285Migration.csv
Open
3MB
FPGA-DS-02012-3-3-ECP5-ECP5G-Family-Data-Sheet.pdf
PDF
Open
6MB
FPGA-TN-02024-5-6-PCB-Layout-Rec-for-BGA Packages.pdf
PDF
Open
560KB
FPGA-TN-02028-2-6-Sub-LVDS-Signaling-Using-Lattice-Devices.pdf
PDF
Open
1MB
FPGA-TN-02032-1-4-ECP5-ECP5G-sysIO-Usage-Guide.pdf
PDF
Open
3MB
FPGA-TN-02035-1-3-ECP5-ECP5-5G-HighSpeed-IO-Interface.pdf
PDF
Open
584KB
FPGA-TN-02038-2-0-ECP5-and-ECP5-5G-Hardware-Checklist.pdf
PDF
Open
2MB
FPGA-TN-02050-1-0-Programming-Ext-SPI-Flash-JTAG-ECP5-5G.pdf
PDF
Open
1MB
FPGA-TN-02200-1-3-ECP5-and-ECP5-5G-sysCLOCK-PLL-DLL-Design-and-User-Guide.pdf
PDF
Open

Power Supply

2MB
lm3880.pdf
PDF
Open
2MB
NCP115-D.PDF
PDF
Open
1MB
tlv62569.pdf
PDF
Open
803KB
tpd1s414.pdf
PDF
Open

Last updated 1 year ago

  • Datasheets Used in the OPU Driver PCB
  • ECP5 Files
  • Power Supply