LogoLogo
contribute.
  • Hacker Fab Documentation
  • Overview
    • ✨Current Fab Capabilities
      • Fab Capabilities November 2023
      • Fab Capabilities May 2023
  • 🟡Guides
    • Required Reading (todo)
    • Build-a-Fab
    • Filling in the Gaps - Background Resources
    • Part Sourcing
  • 📜Processes
    • Self-Aligned NMOS V1
  • Fab Toolkit
    • 🎥Patterning
      • Lithography Stepper V2.1
      • Lithography Stepper V2 Build
      • Lithography Stepper V1 Build
      • Getting started with Klayout
      • Patterning Tasks - Spring 2025
      • Blu-Ray Lithography
        • Work in Progress
          • KEM-497AAA Pin Out Analysis
        • Lithography Spinner V1
          • Documentation
            • Design Datasheets
          • Hardware
            • BU40N Reference Design
          • Software
        • Base Principles
    • 🧱Deposition
      • 💡Thermal Evaporator V1 Build (WIP)
      • Spin Coater V2 Build (work in progress)
      • 💿Spin Coater V1 Build (to do)
      • Electroless Nickel Plating
      • ⚛️DIY ALD
      • ⚡Sputtering Chamber
    • 🕳️Etching
      • Plasma Etcher
      • HF Jig
    • 🛠️Other Processing Machines
      • Tube Furnace
      • Cleaving Jig
    • 🔍Metrology / Characterization
      • Probe Station
      • Semiconductor Parameter Analyzer
        • SMU - Analog Discoveries
        • SMU - Keithley 4200SCS
      • CV Measurements
      • Spectrometer
      • Profilometer
    • ⚗️Chemicals / Materials
      • Photoresists
      • Dielectrics
        • Spin on Glass
      • Conductors
        • Aluminum
      • Etchants
        • Hydrofluoric Acid
        • Aluminum Etchant (Nitric, Acetic, Phosphoric Acids)
      • Dopant Sources
    • 🤖Lab Automation
      • Automated Spin Coater
      • Gantry
      • Gripper
      • Liquid Handling
      • Tube Furnace (automated)
      • Wafer Cleaver
    • 🏘️Submodules
      • Piezo Nanopositioner (Stick Slip)
      • Interferometer
    • 📚Database
      • Machine Integration
      • Steps and Processes
  • 🧑‍🍳Standard Operating Procedures
    • Patterning SOP - Stepper V2
      • Vacuum Spin Coater SOP
      • Hot Plate SOP
      • Photoresist Strip SOP
    • Plasma Etcher SOP
    • Spin on Glass/Diffusant SOP
      • Spin on Glass Storage and Preparation
      • Spin on Glass Defect Inspection
      • Spin on Glass Thickness Measurement
    • Tube Furnace SOP
    • Glass Acid Etch SOP
    • DIY Thermal Evaporator SOP (CMU Version)
    • MTI Evaporator SOP (No longer in use)
    • Aluminum Etch SOP
    • Probe Station SOP
    • Probe Station SOP - V2
    • Wafer Cleaving SOP
    • Dry Oxide Growth SOP
    • Profilometer SOP
  • 🟢WORKING DOCS
    • CMOS Source/Drain Metal Contact Optimization
    • CMOS Doping Process Development
    • Sputtering Gate Oxides + Metal Gate Contacts
    • NAND + Inverter Characterization
    • CMU Updates
      • Example Student
      • Gina Seo
      • Jessica Wen
      • Yang Bai
      • Alex Echols
      • Gongwei Wang
      • Ying Meng
      • Shagun Maheshwari
      • Yuichi Hirose
      • Eric Dubberstein
      • Michael Juan
      • Justin Wang
      • Katie Eisenman
      • Marta Freitas
      • Matthew Choi's Updates
        • Week 2 Updates
        • Week 3 Updates
        • Week 4 Updates
        • Week 5 Update
        • Week 6 Update
        • Week 7 Update
        • Week 8 Update
        • Week 9 Update
        • Week 11 Update
        • Week 12 Update
        • Week 13 Update
      • Sandra You
      • Felicia Liu
      • Melinda Chen
      • Shayaan Gandhi
      • Sky Bailey
      • Haewon Uhm
      • James Lin
      • Ayan Ghosh
      • Advaith Menon
      • Adwoa Asare
      • Qirui (Ridge) Da Updates - Database
  • 🔲Templates (to do)
    • Build Manual Template
    • Bought Equipment Template
    • Standard Operating Procedure Template
    • BOM Template
    • Hardware X Template (for reference)
  • Archive
    • Patterning SOP - Stepper V1
Powered by GitBook
On this page
  • Parameters
  • Purpose
  • Tools
  • Materials
  • Procedure
  • Pre-heating the Furnace
  • Inserting chips
  • Removing chips
  • Safety
Export as PDF
  1. Standard Operating Procedures

Dry Oxide Growth SOP

SOP for dry oxide growth of 10nm SiO2

Last updated 1 year ago

Parameters

Temperature

1100°C

Total Time

30 min (subject to change)

Purpose

The oxidation growth of the silicon layer creates a layer of insulation to prevent direct flow from the conducting MOSFET layer to the metal gate.

  1. Fused silica rod

  2. Fused silica microscope slide

Tools

  1. Fused silica rod

  2. Fused silica microscope slide

Materials

  1. Pure silicon chip (not pre-deposited)

Procedure

Pre-heating the Furnace

  1. Turn on the furnace.

  2. Press and hold “set/ent” for three seconds until “mode res” is showing. Press the up arrow twice until mode “LCL” is selected. Press “enter” once. Now the furnace will hold the temperature shown. Use the arrow keys to adjust and press “enter” once to set the setpoint.

  3. Wait ~15 min for the furnace to come to temperature.

Inserting chips

  1. Put the fused silica microscope slide in the entrance of the tube. Do not use a regular borosilicate microscope slide, or it will melt inside the tube. The edge of a fused silica slide is pure white, while borosilicate is a little bit green.

  1. Place your chips on the slide.

  2. Use the glass rod to push the slide into the center of the tube, being careful to not scratch the inside of the tube too much. Start the timer.

  3. Place the rod on top of the tube furnace (it will be hot).

Removing chips

  1. Use the glass rod to push the slide to the other end of the tube.

    1. Push the slide all the way to the end until it is reachable.

    2. Put the rod on top of the tube furnace (it will be hot).

  2. Wait a few minutes for the slide to cool down.

  3. Use metal tweezers to take the slide out. Don't use the orange ones because they don't close all the way.

  4. Put the slide on a heat resistant surface and wait 5 minutes before handling the chip.

Safety

The furnace is obviously very hot. Keep away from any hot parts of the furnace. The rod will heat up in the few seconds that it is inside the tube, so when removing it, only hold it by the end.

The rod and tube also channel heat out of their ends via internal reflection of radiation.

Tube Furnace () with fused silica tube

Tube Furnace () with fused silica tube

If the furnace stops and holds at a lower temperature than your setpoint, the high temperature alarm may be too low. Read the instructions on to fix this.

A chip permanently fused to the tube furnace walls when improper slide was used

🧑‍🍳
🔥
ThermoFisher Manual
ThermoFisher Manual
page 6-7
Silicon before and after oxidation