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  • Hacker Fab Documentation
  • Overview
    • ✨Current Fab Capabilities
      • Fab Capabilities November 2023
      • Fab Capabilities May 2023
  • 🟡Guides
    • Required Reading (todo)
    • Build-a-Fab
    • Filling in the Gaps - Background Resources
    • Part Sourcing
  • 📜Processes
    • Self-Aligned NMOS V1
  • Fab Toolkit
    • 🎥Patterning
      • Lithography Stepper V2.1
      • Lithography Stepper V2 Build
      • Lithography Stepper V1 Build
      • Getting started with Klayout
      • Patterning Tasks - Spring 2025
      • Blu-Ray Lithography
        • Work in Progress
          • KEM-497AAA Pin Out Analysis
        • Lithography Spinner V1
          • Documentation
            • Design Datasheets
          • Hardware
            • BU40N Reference Design
          • Software
        • Base Principles
    • 🧱Deposition
      • 💡Thermal Evaporator V1 Build (WIP)
      • Spin Coater V2 Build (work in progress)
      • 💿Spin Coater V1 Build (to do)
      • Electroless Nickel Plating
      • ⚛️DIY ALD
      • ⚡Sputtering Chamber
    • 🕳️Etching
      • Plasma Etcher
      • HF Jig
    • 🛠️Other Processing Machines
      • Tube Furnace
      • Cleaving Jig
    • 🔍Metrology / Characterization
      • Probe Station
      • Semiconductor Parameter Analyzer
        • SMU - Analog Discoveries
        • SMU - Keithley 4200SCS
      • CV Measurements
      • Spectrometer
      • Profilometer
    • ⚗️Chemicals / Materials
      • Photoresists
      • Dielectrics
        • Spin on Glass
      • Conductors
        • Aluminum
      • Etchants
        • Hydrofluoric Acid
        • Aluminum Etchant (Nitric, Acetic, Phosphoric Acids)
      • Dopant Sources
    • 🤖Lab Automation
      • Automated Spin Coater
      • Gantry
      • Gripper
      • Liquid Handling
      • Tube Furnace (automated)
      • Wafer Cleaver
    • 🏘️Submodules
      • Piezo Nanopositioner (Stick Slip)
      • Interferometer
    • 📚Database
      • Machine Integration
      • Steps and Processes
  • 🧑‍🍳Standard Operating Procedures
    • Patterning SOP - Stepper V2
      • Vacuum Spin Coater SOP
      • Hot Plate SOP
      • Photoresist Strip SOP
    • Plasma Etcher SOP
    • Spin on Glass/Diffusant SOP
      • Spin on Glass Storage and Preparation
      • Spin on Glass Defect Inspection
      • Spin on Glass Thickness Measurement
    • Tube Furnace SOP
    • Glass Acid Etch SOP
    • DIY Thermal Evaporator SOP (CMU Version)
    • MTI Evaporator SOP (No longer in use)
    • Aluminum Etch SOP
    • Probe Station SOP
    • Probe Station SOP - V2
    • Wafer Cleaving SOP
    • Dry Oxide Growth SOP
    • Profilometer SOP
  • 🟢WORKING DOCS
    • CMOS Source/Drain Metal Contact Optimization
    • CMOS Doping Process Development
    • Sputtering Gate Oxides + Metal Gate Contacts
    • NAND + Inverter Characterization
    • CMU Updates
      • Example Student
      • Gina Seo
      • Jessica Wen
      • Yang Bai
      • Alex Echols
      • Gongwei Wang
      • Ying Meng
      • Shagun Maheshwari
      • Yuichi Hirose
      • Eric Dubberstein
      • Michael Juan
      • Justin Wang
      • Katie Eisenman
      • Marta Freitas
      • Matthew Choi's Updates
        • Week 2 Updates
        • Week 3 Updates
        • Week 4 Updates
        • Week 5 Update
        • Week 6 Update
        • Week 7 Update
        • Week 8 Update
        • Week 9 Update
        • Week 11 Update
        • Week 12 Update
        • Week 13 Update
      • Sandra You
      • Felicia Liu
      • Melinda Chen
      • Shayaan Gandhi
      • Sky Bailey
      • Haewon Uhm
      • James Lin
      • Ayan Ghosh
      • Advaith Menon
      • Adwoa Asare
      • Qirui (Ridge) Da Updates - Database
  • 🔲Templates (to do)
    • Build Manual Template
    • Bought Equipment Template
    • Standard Operating Procedure Template
    • BOM Template
    • Hardware X Template (for reference)
  • Archive
    • Patterning SOP - Stepper V1
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On this page
  • Goals:
  • Non-Goals:
  • The 1970s vs. Now
  • On Open-Source Hardware
  • Design Constraints
  • On Improvement
  • On Cleanliness
  • On Process Node
  • On Education
  • Where to Start
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  1. Guides

Required Reading (todo)

The goal function of the Hacker Fab is to never debug the same thing twice.

We operate under different constraints from the semiconductor fab industry. This allows us to curb a lot of complexity.

Goals:

  1. Low cost

  2. Create the simplest designs possible

    1. Increase reliability

    2. Reduce manufacturing complexity

  3. Minimal danger

  4. Small size

  5. No cleanroom

  6. Highly sourcable materials

  7. High literacy in understanding working principles of tools and processes

  8. End-to-end custom - from sand to NAND

    1. Make the wafers

    2. Design the tools

    3. Design the processes

    4. Design the IC

    5. Package the chip

Non-Goals:

  1. Reuse of existing fab equipment

The 1970s vs. Now

On Open-Source Hardware

Who we are looking for, how we grow, how to get support

Design Constraints

On Improvement

Central to the Hacker Fab is fast turnaround hardware development - it’s in the name. This means extremely fast hardware prototyping, and with that comes the need for iteration. The careful design constraints placed on all projects and focus on documentation enables someone else to iterate on anything developed in the Hacker Fab. Improvement to a V1, V2, Vn of a design means

  1. Directly improving upon a tool’s functionality

    1. Precision

    2. Reliability

    3. Throughput

    4. New features

    5. Safety

But there are other equally important ways to improve a design. Every tool version should try to be:

  1. Easier to manufacture than the last

    1. Reduce number of tools required to manufacture

    2. Reduce # of vendors, lead time, BOM length

  2. Better documented than the last

    1. Tool specs as close to first principles as possible

    2. Every tool spec should have a standardized test for others to verify performance

    3. Explain working principles to the detail of variables we can control (no more, no less). Referenced sources.

  3. More “closed-loop” than the last

    1. In-situ sensors

    2. Calibration software should be more generalizable (“now you can use any camera…any piezo with draw distance in range X to Y…”)

On Cleanliness

On Process Node

On Education

Where to Start

Last updated 1 year ago

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